Glass Circuit Board (GCB) with Photosensitive Glass : Products & Services

Hoya offers a photosensitive glass substrate capable of creating micro-structure with standard photolithography methods. The substrate can be further enhanced with copper wires and via-holes to create a glass circuit board for use in various opto-electrical applications.

Features

Via-Hole and Trench Structure

  • High Aspect Ratio
  • Small Diameter
  • 3-Dimensional Fabrication Process
  • Transmits Light (PEG3)
  • Low Tolerances and High Reliability
  • Smooth and Flat Surface
Applications

Glass Circuit Board

  • Ink-Jet Print Head
  • MEMS
  • Flat Panel Display

Optical Fiber Guide

  • Optical-Electric Conversion Modules
  • Wire Guide for IC Final Tester


Cross Section of Glass Circuit Board



  • Smoothness of glass substrate contributes to reduction of signal transmission loss and very fine circuit pattern on both sides.
  • Copper filling structure of Via-Holes provides superior air-tightness and reduction of electronical resistance.
Characteristics of Photosensitive Glass
Item Unit Measured condition PEG3(*1) Crystallized PEG3C(*1)
Thermal Properties
Coefficient of Thermal Expansion ppm/K TMA(*2) 8.4 10.5
Thermal Conductivity W/m·K 25°C 0.7950 2.7196
Glass Transition Point °C   465 <800
Mechanical Properties
Young's Modulus GPa   79.7 90.3
Poisson's Ratio     0.22 0.19
Bending Strength MPa   >65 >150
Electrical Properties
Dielectric Constant   1 GHz - RT
5GHz - RT
6.28
6.21
5.26
5.22
Dielectric Dissipation Factor   1 GHz - RT
5GHz - RT
0.0116
0.0150
0.0072
0.0106
Volume Resistivity 25°C 8.5 × 1012 4.5 × 1014
Design Rules(*3)
Thickness mm   0.1 ~ 1.0 0.1 ~ 1.0
Hole Diameter μm Minimum ~10 ~10
Aspect ratio of Via Hole   Thickness/Via Hole Diameter ~30 ~30
Tolerance of Via Hole % (*4) ±0.02 ±0.03
This data was made as of July 1, 2006.
Due to continued product improvement, specifications are subject to change without notice.

(*1) PEG3 and PEG3C are the registered trademarks of HOYA.
PEG3 Photosensitive Etching Glass/Version3.PEG3C is Crystallized PEG3.
(*2) TMA : Thermo Mechanical Analysis.
(*3) High level
(*4) Special grade available +/ -0.015