Hoya offers a photosensitive glass substrate capable of creating micro-structure with standard
photolithography methods. The substrate can be further enhanced with copper wires and via-holes
to create a glass circuit board for use in various opto-electrical applications.
| Features |
|
Via-Hole and Trench Structure
- High Aspect Ratio
- Small Diameter
- 3-Dimensional Fabrication Process
- Transmits Light (PEG3)
- Low Tolerances and High Reliability
- Smooth and Flat Surface
|
|
| Applications |
|
Glass Circuit Board
- Ink-Jet Print Head
- MEMS
- Flat Panel Display
Optical Fiber Guide
- Optical-Electric Conversion Modules
- Wire Guide for IC Final Tester
|
|
Cross Section of Glass Circuit Board
- Smoothness of glass substrate contributes to reduction of signal transmission loss and very fine circuit pattern on both sides.
- Copper filling structure of Via-Holes provides superior air-tightness and reduction of electronical resistance.
| Characteristics of Photosensitive Glass |
| Item |
Unit |
Measured condition |
PEG3(*1) |
Crystallized PEG3C(*1) |
| Thermal Properties |
| Coefficient of Thermal Expansion |
ppm/K |
TMA(*2) |
8.4 |
10.5 |
| Thermal Conductivity |
W/m·K |
25°C |
0.7950 |
2.7196 |
| Glass Transition Point |
°C |
|
465 |
<800 |
| Mechanical Properties |
| Young's Modulus |
GPa |
|
79.7 |
90.3 |
| Poisson's Ratio |
|
|
0.22 |
0.19 |
| Bending Strength |
MPa |
|
>65 |
>150 |
| Electrical Properties |
| Dielectric Constant |
|
1 GHz - RT 5GHz - RT |
6.28 6.21 |
5.26 5.22 |
| Dielectric Dissipation Factor |
|
1 GHz - RT 5GHz - RT |
0.0116 0.0150 |
0.0072 0.0106 |
| Volume Resistivity |
Ω |
25°C |
8.5 × 1012 |
4.5 × 1014 |
| Design Rules(*3) |
| Thickness |
mm |
|
0.1 ~ 1.0 |
0.1 ~ 1.0 |
| Hole Diameter |
μm |
Minimum |
~10 |
~10 |
| Aspect ratio of Via Hole |
|
Thickness/Via Hole Diameter |
~30 |
~30 |
| Tolerance of Via Hole |
% |
(*4) |
±0.02 |
±0.03 |
This data was made as of July 1, 2006. Due to continued product improvement, specifications are subject to change without notice. |