Quartz: High Precision Fused Silica Wafers
HOYA offers Quartz Wafers with Standard and Ultra-Parallel surfaces.
Features
- Dimensional Replica of Standard Silicon Wafers
- Ultra-Parallel
- Super Fine Surface Finish
- High Transmission
|
Applications
- Biotech Arrays
- Photomasks
- Sensors
- Telecom
|
| Dimensions |
|---|
| Product Code |
Diameter (± 0.3mm) |
Thickness (± 0.05mm) |
Ori-Flat (± 2.5mm) |
|---|
| 4 W 55 |
100.0 |
0.525 |
32.5 |
| 5 W 65 |
125.0 |
0.625 |
42.5 |
| 6 W 675 |
150.0 |
0.675 |
57.5 |
| Physical Specifications |
|---|
|
Standard Products |
Ultra-Parallel Products |
|---|
| Inclusion |
None
(@ > 3µm) |
None
(@ > 3µm) |
| Scratch |
None
(@ > 1µm) |
None
(@ > 20µm) |
| Sleek |
None
(@ > 3µm) |
None
(@ > 30µm) |
| Pit |
0.05 pcs/cm2
(@ > 1-4µm) |
0.05 pcs/cm2
(@ > 10-30µm) |
| Total Thickness Variation |
- |
< 3µm |
| Local Thickness Variation (20mm sq.) |
- |
< 0.5µm |
| Physical Properties |
|---|
| Coefficient of Thermal Expansion |
5.0 x 10-7 (50-200°C) |
| Annealing Point |
1,120°C |
| Optical Properties |
|---|
| Refractive Index (nd) |
1.46 |
| Chemical Properties |
|---|
| Wt. loss DI water |
0.000% (100°C, 1 hour) |
| Wt. loss 1/100N HNO3 |
0.000% (100°C, 1 hour) |
| Wt. loss 5% NaOH |
0.17% (80°C, 1 hour) |
| Mechanical Properties |
|---|
| Specific Gravity |
2.20 |
| Young's Modulus |
7,413 Kg/mm2 |
| Sheer Modulus |
3,170 Kg/mm2 |
| Poisson's Ratio |
0.18 |
| Knoop Hardness |
615 Kg/mm2 |
| Lapping Hardness |
210 |
| Electrical Properties |
|---|
| Surface Resistivity |
1 x 1019 Ω |
| Bulk |
1 x 1018 Ω•cm2 |
Note: The listed data are standard value. Because of continuous product improvement, the various data listed are subject to change without notice.
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